Glycidyloxypropyltrimethoxysilane Epoxy Silane CAS 2530-83-8 Glymo Silicone Compound

Model NO.
HENGDA-M3133
Industries
Coatings, Fiberglass, Resins, Adhesives Sealants
Trade Name
Hengda-M3133
Goods Ready Time
Within 7days
Reach
Yes
Transport Package
Drum, IBC Tote
Specification
99%min
Trademark
HENGDA
Origin
China
Production Capacity
12000mt/Year
Reference Price
$ 4.50 - 9.00
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Product Description

CAS 2530-83-8 GLYMO Epoxy Silane Glycidyloxypropyltrimethoxysilane Silano
CAS# 2530-83-8
Amino Silane, equivalent to GLYMO, A187, Z6040, KBM403, GF31
Product Parameters
Appearance colorless transparent liquid
Purity ≥98%; ≥99%
Density (ρ20), g/cm3 1.060-1.080
Molecular Weight 236.34
Refractive Index (n25D) 1.4220-1.4320
Packaging & Shipping
Glycidyloxypropyltrimethoxysilane Epoxy Silane CAS 2530-83-8 Glymo Silicone Compound
Glycidyloxypropyltrimethoxysilane Epoxy Silane CAS 2530-83-8 Glymo Silicone Compound
Glycidyloxypropyltrimethoxysilane Epoxy Silane CAS 2530-83-8 Glymo Silicone Compound
Company Profile

- HENGDA Chemical was established in 1965, we are the first silane coupling agent manufacturer in China. 

- Owns 2 plants in Gaizhou and Weifang city separately.

- ISO 9001 certified company

- DCS automotive control; SIS, waste water & gas treatment control systerm
 
Our Advantages

- Extensive production and technical experience from long manufacturing history since 1965. 
- Combining upstream & down stream, low cost makes competitive price
- Stable quality, Fast shipping, High effeciency service responce 
- REACH available

Appication
  1. It is used in the production process of fiberglass, as a size ingredient.
  2. It is used as an additive to polyurethane resins used in foundry.
  3. It is used in polysulfides and polyurethanes, epoxy resin adhesive, filled or reinforced thermoset resins, fiberglass adhesive and inorganic-filled or glass-reinforced thermoplastic resins etc.
  4. It is used to enhance the electrical performance of epoxy-based electronic sealants and packaging materials and printed circuit boards, improving the bond between the resin and the matrix or filler.
  5. It is used in a wide range of fillers and matrices, including clay, talc, wollastonite, silica, quartz or metals such as aluminium, copper and iron.

 

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