Metal Bellows Seal, Welded Metal Bellow for Semiconductor Industry

Model NO.
TS
Type
Vacuum Welded Metal Bellow
Balance
Standard
Metal Bellows
535 Series Protector in Esp
CVD
0015-055
Double Layer Metal Bellow Seal
Borets
Vacuum Metal Bellow Seal
Almaz-Hmao
Metal Bellows Seal
Novomet
Etcher Bellow
839-330743-002
Etcher
839-093786-001
Sputter
852-Blf
Vacuum Metal Bellow
Welded Metal Bellows
Metal Bellow Seal
for Semiconductor Industry
Transport Package
Neutral Packing
Specification
all sizes
Trademark
TRISUN
Origin
China
HS Code
84842000
Production Capacity
200, 000
Reference Price
$ 0.81 - 0.90
Contact Us

Product Description

Applications : To achieve high vacuum
                             To achieve mechanical movement
                             To absorb shock
Semiconductor, Aero-space, Weapon Technology, Precision Measurement, Accelerator, High vacuum, semiconductor industry, solar energy photovoltaic industry, medical equipments, synchronized radiation accelerator industry


For mechanical seals, Isolation valves, Linear motion heavy duty, pneumatic, multi-motion wobble stick, pincer, etc.


Metal Bellows Seal, Welded Metal Bellow for Semiconductor Industry
Metal Bellows Seal, Welded Metal Bellow for Semiconductor Industry
Metal Bellows Seal, Welded Metal Bellow for Semiconductor Industry
Metal Bellows Seal, Welded Metal Bellow for Semiconductor Industry


1. Apply Hardened Stainless Steel,Hastelloy C,316L,Inconel 718 for Bellows.
2. Fit for the requirement of High Speed,High Temperature,High Pressure.
3.Welded metal bellows inner some degree, which can reduce stress.
4. Mechanical seal performance is stable and reliable.

Specification:
1,Outer diameter:Customized
2,Inner diameter:  Customized 
3,Material: Vacuum SUS 316L,SUS 304,AM350,Hastelloy alloy C Haynes alloy 242,Inconel 625 and 718 alloy, titanium 
4,Compression: 70%
5,Extended rate:5% 
6,Vacuum Leak rage: 1×10-13Pa·m3/s
7,Life Time: >100,000 Cycles
8,Welcome customized.
9, Operating Direction: Vertical or Horizontal

 

Mechanical Seal

PNEUTEC.IT, 2023