Packing form boxed
Performance parameter
The CPU is 3.3GHz
Up to 4.3GHz
Number of cores ten cores
Number of threads 20 threads
Level 2 cache 10MB
Level 3 cache 13.75MB
Bus specifications DMI3 8GT/s
Thermal design power consumption (TDP) 140W
Memory parameter
Supports a maximum memory of 128GB
The memory type is DDR4 2666MHz
Maximum number of memory channels 4
Package specification
Slot type LGA 2066
Technical parameter
Rui Frequency acceleration technical support, 2.0
Hyper-threading technical support
Packing form boxed
Performance parameter
The CPU is 3.3GHz
Up to 4.3GHz
Number of cores ten cores
Number of threads 20 threads
Level 2 cache 10MB
Level 3 cache 13.75MB
Bus specifications DMI3 8GT/s
Thermal design power consumption (TDP) 140W
Memory parameter
Supports a maximum memory of 128GB
The memory type is DDR4 2666MHz
Maximum number of memory channels 4
Package specification
Slot type LGA 2066
Technical parameter
Rui Frequency acceleration technical support, 2.0
Hyper-threading technical support
Packing form boxed
Performance parameter
The CPU is 3.3GHz
Up to 4.3GHz
Number of cores ten cores
Number of threads 20 threads
Level 2 cache 10MB
Level 3 cache 13.75MB
Bus specifications DMI3 8GT/s
Thermal design power consumption (TDP) 140W
Memory parameter
Supports a maximum memory of 128GB
The memory type is DDR4 2666MHz
Maximum number of memory channels 4
Package specification
Slot type LGA 2066
Technical parameter
Rui Frequency acceleration technical support, 2.0
Hyper-threading technical support
Quantity (pieces) | 1 - 100 | 101 - 200 | 201 - 300 | > 300 |
Lead time (days) | 3 | 5 | 7 | To be negotiated |