High Quality Pi PCB Board Industry Control FPC

Model NO.
HC000044
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
UC
PCB Testing
Flying Probe Testing/E-Testing
Lead Time
7 Working Days
Ipc Standards
Ipc-Class 2
Base Material Type
Pi
Fast Turn
3 Working Days
Surface Treatment
Enig
Finished Copper Thickness
35um
Size
500*8mm
Board Thickness
0.15-0.2mm
Board Layer
1
Transport Package
Vacuum
Specification
UL(US&Canada). ISO. RoHs, TS, SGS
Trademark
UC
Origin
China
HS Code
8534009000
Production Capacity
20000 Sqm/Month
Reference Price
$ 0.18 - 0.45
Contact Us

Product Description


                      Ucreate LTD PCB's aim  Customer Satisfaction is Always Our First Priority!
 
                   

 
*Quality Policy

*Top Quality and high efficiency

*Improve continuously

* Achieve customer's satisfaction
 

1.Products Application

High Quality Pi PCB Board Industry Control FPC

 

2. Market Distribution
 
High Quality Pi PCB Board Industry Control FPC
 
 
3.Technical Capabilities
Items Speci. Remark
Max panel size 32 " x 20.5"(800mm x 520mm)  
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control 		±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1 -30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  
Hole precision ±2 mil(±50 um)  
tolerance for Slot ±3 mil(±75 um)  
tolerance for PTH ±3 mil(±75um )  
tolerance for NPTH ±2mil(±50um)  
Max Aspect Ratio for PTH 8:1  
Hole wall copper thickness 15-50um  
Alignment of outer layers 4mil/4mil  
Min trace width/space for outer layer 4mil/4mil  
Tolerance of Etching +/-10%  
Thickness of solder mask on trace 0.4-1.2mil(10-30um)  
at trace corner ≥0.2mil(5um)  
On base material ≤+1.2mil
  Finished thickness 		 
Hardness of solder mask 6H  
Alignment of solder mask film ±2mil(+/-50um)  
Min width of solder mask bridge 4mil(100um)  
Max hole with solder plug 0.5mm  
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.  
Max Nickel thickness for Gold finger 280u"(7um)  
Max gold thickness for Gold finger 30u"(0.75um)  
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)  
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)  
Impedance control and its tolerance 50 ±10%,75±10% ,100±10% 110±10%  
Trace Anti-stripped strength ≥61B/in(≥107g/mm)  
bow and twist
  		0.75%  

4.Production Process
     High Quality Pi PCB Board Industry Control FPC
5.Products Equipment
High Quality Pi PCB Board Industry Control FPC
High Quality Pi PCB Board Industry Control FPC
High Quality Pi PCB Board Industry Control FPC

6.Packaging and Transport

 

 

FPC

PNEUTEC.IT, 2023