2 Layer 35um Copper PCB for LED/Electronic Device Custom PCB Maker

Model NO.
UC-3652
Base Material
Aluminum
Insulation Materials
Metal Composite Materials
Model
PCB
Brand
Uc
Ipc Standards
Ipc Class II
PCB Testing
E-Testing, Flying Probe Testing
Fast Turn
3 Working Days
Special
Immersion Gold
Lead Time
5-8 Working Days
Base
Aluminum
Surface Treatment
HASL Lead Free
Solder Mask Color
White
Thickness
1.6mm
Layers
2
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO. RoHs, TS, SGS
Trademark
UC
Origin
Shenzhen, China
HS Code
8534009000
Production Capacity
20000 Sqm/Month
Reference Price
$ 0.08 - 0.09
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Product Description

                             Ucreate LTD PCB's aim Customer Satisfaction is Always Our First Priority!
 
                   

 
*Quality Policy 

*Top Quality and high efficiency

*Improve continuously

*Achieve customer's satisfaction
 

1.Products Application

2 Layer 35um Copper PCB for LED/Electronic Device Custom PCB Maker


 

2. Market Distribution

2 Layer 35um Copper PCB for LED/Electronic Device Custom PCB Maker  

 
 
3.Technical Capabilities
Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)  
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control 		±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1-30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  
Hole precision ±2 mil(±50 um)  
tolerance for Slot ±3 mil(±75 um)  
tolerance for PTH ±3 mil(±75um)  
tolerance for NPTH ±2mil(±50um)  
Max Aspect Ratio for PTH 8:1  
Hole wall copper thickness 15-50um  
Alignment of outer layers 4mil/4mil  
Min trace width/space for outer layer 4mil/4mil  
Tolerance of Etching +/-10%  
Thickness of solder mask on trace 0.4-1.2mil(10-30um)  
at trace corner ≥0.2mil(5um)  
On base material ≤+1.2mil
  Finished thickness 		 
Hardness of solder mask 6H  
Alignment of solder mask film ±2mil(+/-50um)  
Min width of solder mask bridge 4mil(100um)  
Max hole with solder plug 0.5mm  
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.  
Max Nickel thickness for Gold finger 280u"(7um)  
Max gold thickness for Gold finger 30u"(0.75um)  
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)  
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)  
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%  
Trace Anti-stripped strength ≥61B/in(≥107g/mm)  
bow and twist
  		0.75%  
 
4.Products Equipment
2 Layer 35um Copper PCB for LED/Electronic Device Custom PCB Maker
2 Layer 35um Copper PCB for LED/Electronic Device Custom PCB Maker
2 Layer 35um Copper PCB for LED/Electronic Device Custom PCB Maker


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