32 Layer Backplane PCB Circuit with Good Quality

Model NO.
UC-36852
Base Material
Copper
Insulation Materials
Organic Resin
Model
PCB
Brand
Uc
Soldermask Color
Green
Surface Finish
OSP
Lead Time
9 Working Days
PCB Testing
E-Testing, Flying Probe Testing
Ipc Standards
Ipc Class II
Finished Copper Thickness
All 35um
Thickness Material
Fr4
Board Thickness
4.415+0.46/-0.42mm
Size
282mm×750mm
Layer Count
32 Layers
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO9001. RoHs, TS, SGS
Trademark
UC
Origin
Shenzhen, China
HS Code
8534001000
Production Capacity
20000sqm/Month
Reference Price
$ 0.45 - 1.80
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Product Description

                     
                       Ucreate LTD PCB's aim  Customer Satisfaction is Always Our First Priority!
 
                   

 
*Quality Policy 

*Top Quality and high efficiency

*Improve continuously

*Achieve customer's satisfaction
 

1.Products Application

32 Layer Backplane PCB Circuit with Good Quality

 

2. Market Distribution
 
32 Layer Backplane PCB Circuit with Good Quality
 
 
3.Technical Capabilities
Items Speci. Remark
Max panel size 32 " x 20.5"(800mm x 520mm)  
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)  
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz  
Outer copper thickness 0.5~6 oz  
Finished board thickness 0.4-3.2 mm  

Board thickness tolerance control 		±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation  
Layer count Capability 1 -30 LAYER  
alignment between ML ±2mil  
Min drilling 0.15 mm  
Min finished hole 0.1 mm  
Hole precision ±2 mil(±50 um)  
tolerance for Slot ±3 mil(±75 um)  
tolerance for PTH ±3 mil(±75um )  
tolerance for NPTH ±2mil(±50um)  
Max Aspect Ratio for PTH 8:1  
Hole wall copper thickness 15-50um  
Alignment of outer layers 4mil/4mil  
Min trace width/space for outer layer 4mil/4mil  
Tolerance of Etching +/-10%  
Thickness of solder mask on trace 0.4-1.2mil(10-30um)  
at trace corner ≥0.2mil(5um)  
On base material ≤+1.2mil
  Finished thickness 		 
Hardness of solder mask 6H  
Alignment of solder mask film ±2mil(+/-50um)  
Min width of solder mask bridge 4mil(100um)  
Max hole with solder plug 0.5mm  
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.  
Max Nickel thickness for Gold finger 280u"(7um)  
Max gold thickness for Gold finger 30u"(0.75um)  
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)  
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)  
Impedance control and its tolerance 50 ±10%,75±10% ,100±10% 110±10%  
Trace Anti-stripped strength ≥61B/in(≥107g/mm)  
bow and twist
  		0.75%  
 
4.Products Equipment
32 Layer Backplane PCB Circuit with Good Quality
32 Layer Backplane PCB Circuit with Good Quality
32 Layer Backplane PCB Circuit with Good Quality

5.Production Process

     32 Layer Backplane PCB Circuit with Good Quality
 
6.Russia Exhibition

 

Double-Sided PCB

PNEUTEC.IT, 2023